| 型号/型号规格 | 分类 | 品牌 | 封装 | 批号 | 数量 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| SAK-TC1762-128F80HL AC | 单片机MCU |
INFINEON/英飞凌 |
TQFP176 |
13+ |
240 |
|||
| SY8286BRAC | IC |
SILERGY/矽力杰 |
QFN-20 |
20+ |
225 |
|||
| PI3WVR12412ZHEX | IC |
DIODES/美台 |
QFN |
22+ |
1578 |
|||
| PS8560QFN40GTR-A1 | IC |
PARADE/谱瑞科技 |
QFN |
22+ |
110 |
|||
| PM6C-1001A | PPT/磁创 |
SOP-24 |
18+ |
2742 |
||||
| TS3DS10224RUKR | 其他被动元件 |
TI/德州仪器 |
WQFN-20 |
20+ |
1044 |
|||
| MP2888AGU-9999-Z | MPS/美国芯源 |
QFN |
21+ |
89 |
||||
| LBA110S | CLAREIXYS |
SOP8 |
2243+ |
224 |
||||
| R5F21354DNFP | 其他被动元件 |
RENESAS/瑞萨 |
QFP |
16+ |
1591 |
|||
| MPQ8632GLE-12-P | IC |
MPS/美国芯源 |
QFN16 |
17+ |
40 |
|||
| TPS61178RNWR | 其他IC |
TI/德州仪器 |
VQFN13 |
21+ |
38 |
|||
| MAX9890BEBL+T | MAXIM/美信 |
USCSP-9 |
2034 |
3852 |
||||
| MX25V4006EM1I-13G | FLASH存储器 |
MXIC/旺宏 |
SOP-8 |
2005 |
1548 |
|||
| MP2950GVT-0005-Z | MPS/美国芯源 |
QFN |
2116 |
1500 |
||||
| ANX7440QN-CB-T | ANAGLOGIX |
QFN |
1740 |
188 |
||||
| MSP430F2272IYFFR | 其他IC |
TI/德州仪器 |
BGA |
19+ |
42500 |
|||
| SC2262 | SCHAFFNER/夏弗纳 |
DIP20 |
15+ |
8885 |
||||
| PE42423B-Z | PSENI |
QFN |
16+ |
112 |
||||
| PKE00BB | NIKO-SEM/尼克森 |
PDFN5x6 |
22+ |
1714 |
||||
| SFH615AA | 光电耦合器 |
VISHAY/威世 |
DIP4 |
20+ |
100 |
|||
| TE28F800C3TA90 | 内存芯片 |
INTEL/英特尔 |
TSOP48 |
19+ |
77 |
|||
| G517F1T12U | GMT/致新 |
SOT23-5 |
20+ |
3000 |
||||
| G517G1TO1U | 电池充电和管理IC |
GMT/致新 |
SOT23-5 |
21+ |
3000 |
|||
| DSB535SB-26.000MHZ | KDS |
SMD |
20+ |
1330 |
||||
| HYB18TC1G160C2F-1.9 | QIMONDA |
BGA |
09+ |
40 |
||||
| HYB25DC256163CE-4 | QIMONDA |
TSOP66 |
08+11+ |
185 |
||||
| HYB18TC512160B2F-3S | QIMONDA |
BGA |
09+13+ |
353 |
||||
| K4T1G164QE-HCF7 | 存储IC |
SAMSUNG/三星 |
BGA |
11+ |
21 |
|||
| S25FL064A | SPANSION/飞索半导体 |
SOP16 |
11+ |
374 |
||||
| M12L16161A-5T | ESMT/晶豪科技 |
TSOP50 |
09+ |
27 |