| 型号/型号规格 | 分类 | 品牌 | 封装 | 批号 | 数量 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| SMB-2360-0-MQFN62-MT-020 | QUALCOMM/高通 |
QFN |
23+ |
485 |
||||
| PMC-8380-0-WLPSP108B-HR-01-0-00 | QUALCOMM/高通 |
BGA |
23+ |
700 |
||||
| GD25LR512MEYIGR | GD/兆易创新 |
WSON8 |
24+ |
169 |
||||
| BP2522D | BPS/晶丰明源 |
SOT33-5 |
20+ |
3895 |
||||
| MSP430F413IPMR | TI/德州仪器 |
LQFP64 |
25+ |
71 |
||||
| SM2082EGS | SM/明微 |
ESOP8 |
19+ |
3938 |
||||
| BP1633CJ | BPS/晶丰明源 |
SOP8 |
20+ |
771 |
||||
| VCHA075D-330MS6 | CYNTEC/乾坤 |
SMD |
22+ |
69000 |
||||
| CXP83124A-040Q | SONY/索尼 |
QFP |
00+ |
1199 |
||||
| GN-8720B | FURUNO/古野 |
SMD |
19+ |
14000 |
||||
| SG-8002JC 27.6M PCC-L2 | EPSON/爱普生 |
SMD4 |
22+ |
967 |
||||
| SG-8002JC 48.000000 MHZ | EPSON/爱普生 |
SMD4 |
22+ |
1000 |
||||
| M26FB-03-BT | QUECTEL/移远通信 |
LCC |
17+ |
15 |
||||
| LM13700M | NS/美国国半 |
SOP16 |
11+ |
1400 |
||||
| CHS-10TB | Copal(日本科宝) |
SMD |
20+ |
500 |
||||
| FM33A048EV | FM/富满 |
LQFP80 |
23+ |
32 |
||||
| ATXMEGA64A1U-CU | MICROCHIP/微芯 |
TFBGA-100 |
22+ |
10000 |
||||
| A8435EESTR-T | ALLEGRO/美国埃戈罗 |
QFN16 |
08+ |
490 |
||||
| MAX3232CSE+T | MAXIM/美信 |
SOP16 |
12+ |
12 |
||||
| PTN38003A | NXP/恩智浦 |
QFN |
21+ |
3000 |
||||
| VG-4231CA 25.000000MHZ | EPSON/爱普生 |
SMD |
21+ |
60 |
||||
| GT-88-B2B | FURUNO/古野 |
SMD |
22+ |
21 |
||||
| ML67Q5605-007NGAZ03A | FURUNO/古野 |
QFP |
14+ |
371 |
||||
| BZX84-C3V3 | NXP/恩智浦 |
SOT23 |
17+ |
2570 |
||||
| HI6825RLIV100D | HISILICON/海思 |
QFN |
20+ |
6000 |
||||
| ALC1322-CG | REALTEK/瑞昱 |
TQFP-48 |
24+ |
124 |
||||
| MBI5264GP | MBI/台湾聚积 |
SSOP24 |
15+ |
210 |
||||
| LT7911UX_U3B00AEI | LONTIUM/龙迅 |
BGA169 |
24+ |
1693 |
||||
| EFM32GG230F512G-E-QFN64R | SILICON/芯科 |
QFN64 |
23+ |
3350 |
||||
| BM10NB(0.8)-30DS-0.4V(51) | HIROSE/广濑 |
SMD |
21+ |
8000 |